Microelectronic Systems in Automobiles

The ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) has been developed entailing € 35m, 9 countries and 40 partners. This system in package development has been developed and funded by public authorities in each of these 9 countries besides the ENIAC Joint Undertaking.

ESiP

The German Ministry of Education and Research (BMBF) was also a provider of funds towards this project from among the national ministries while half of the total budget of €35m was financed by 40 project partners.

System-in-Package means various types of chips which have been crafted with a variety of techniques and of varying dimensions which have been embedded in two ways, either side by side or one above the other so as to work in conjuncture.

This compact and highly efficient SiP device will be effective in electric vehicles, industrial applications and medical equipment besides in communication devices and though considerably smaller in size will be more reliable.